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| MC68HC11F1_13 Datasheet, PDF (136/158 Pages) Freescale Semiconductor, Inc – Technical Data | |||
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Freescale Semiconductor, Inc.
Table A-2 Thermal Characteristics
Characteristic
Symbol
Value
Unit
Average Junction Temperature
TJ
Ambient Temperature
TA
Package Thermal Resistance (Junction-to-Ambient)
QJA
68-Pin Plastic Leaded Chip Carrier
80-Pin Low Profile Quad Flat Pack (LQFP, 1.4 mm Thick)
TA + (PD x QJA)
User-determined
50
80
°C
°C
°C/W
°C/W
Total Power Dissipation
Device Internal Power Dissipation
I/O Pin Power Dissipation
A Constant
(Note 1)
(Note 2)
(Note 3)
PD
PINT
PI/O
K
PINT + PI/O
K / (TJ + 273°C)
IDD x VDD
User-determined
PD
x
(TA +
QJA x
273°C)
PD2
+
W
W
W
W x °C
NOTES:
1 This is an approximate value, neglecting PI/O.
2. For most applications PI/O « PINT and can be neglected.
3. K is a constant pertaining to the device. Solve for K with a known TA and a measured PD (at equilibrium. Use
this value of K to solve for PD and TJ iteratively for any value of TA
ELECTRICAL CHARACTERISTICS
MC68HC11F1
A-2
For More Information On This Product,
TECHNICAL DATA
Go to: www.freescale.com
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