SAM4L_14 Datasheet, PDF (164/176 Pages) ATMEL Corporation – Technology for Ultra-low Power Consumption

Figure 10-11. QFN-48 Package Drawing for ATSAM4LC8 and ATSAM4LS8
ATSAM4L8/L4/L2
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 10-32. Device and Package Maximum Weight
140
Table 10-33. Package Characteristics
Moisture Sensitivity Level
Table 10-34. Package Reference
JEDEC Drawing Reference
JESD97 Classification
mg
MSL3
MO-220
E3
42023GS–SAM–03/2014
164