SAM4L_14 Datasheet, PDF (163/176 Pages) ATMEL Corporation – Technology for Ultra-low Power Consumption

Figure 10-10. QFN-48 Package Drawing for ATSAM4LC4/2 and ATSAM4LS4/2
ATSAM4L8/L4/L2
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 10-29. Device and Package Maximum Weight
140
Table 10-30. Package Characteristics
Moisture Sensitivity Level
Table 10-31. Package Reference
JEDEC Drawing Reference
JESD97 Classification
mg
MSL3
MO-220
E3
42023GS–SAM–03/2014
163