SAM4L_14 Datasheet, PDF (161/176 Pages) ATMEL Corporation – Technology for Ultra-low Power Consumption

Figure 10-8. QFN-64 Package Drawing
ATSAM4L8/L4/L2
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 10-23. Device and Package Maximum Weight
200
mg
Table 10-24. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 10-25. Package Reference
JEDEC Drawing Reference
JESD97 Classification
MO-220
E3
42023GS–SAM–03/2014
161