SMJ320VC5416HFGW10 Datasheet, PDF (92/96 Pages) Texas Instruments – Fixed-Point Digital Signal Processor

Mechanical Data
6 Mechanical Data
6.1 Ceramic Quad Flatpack Mechanical Data
HFG (S-CQFP-F164)
CERAMIC QUAD FLATPACK WITH NCTB
1.140 (28,96)
1.120 (28,45)
SQ
”A”
1.000 (25,40)
BSC
41
1
0.325 (8,26)
0.275 (6,99) ^{Tie Bar Width}
42
164
1.520 (38,61)
1.480 (37,59)
2.505 (63,63)
2.485 (63,12)
82
124
83
123
1.150 (29,21)
BSC 8 Places
0.061 (1,55)
0.059 (1,50) ^{DIA 4 Places}
0.105 (2,67) MAX
0.010 (0,25)
164 X _{0.006 (0,15)}
BRAZE
0,025 (0,64)
DETAIL ”A”
0.040 (1,02)
0.030 (0,76)
0.020 (0,51) MAX
DETAIL ”B”
0.009 (0,23)
0.004 (0,10)
DETAIL ”C”
”C”
”B”
0.018 (0,46) MAX
0.014 (0,36)
0.002 (0,05)
0.130 (3,30) MAX
4040231-9/J 01/99
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Ceramic quad flatpack with flat leads brazed to non-conductive tie bar carrier
D. This package is hermetically sealed with a metal lid.
E. The leads are gold-plated and can be solder-dipped.
F. Leads not shown for clarity purposes
G. Falls within JEDEC MO-113AA (REV D)
Figure 6--1. SMJ320VC5416 164-Pin Ceramic Quad Flatpack (HFG)
82 SGUS035A
April 2003 -- Revised July 2003