TLK105_16 Datasheet, PDF (77/104 Pages) Texas Instruments – TLK105 TLK106 Industrial Temp, Single Port 10/100Mbs Ethernet Physical Layer

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TLK105
TLK106
SLLSEB8C – AUGUST 2012 – REVISED APRIL 2016
9.5 TLK105 32-Pin Industrial Device (85°C) Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC⁽¹⁾
TLK105L,
TLK106L
RHB (VQFN)
UNIT
32 PINS
R_θJA
R_θJB
R_θJC(top)
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-board thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-case (bottom) thermal resistance
36.4
°C/W
9.3
°C/W
26.8
°C/W
1.7
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
9.6 TLK106 32-Pin Extended Temperature (105°C) Device Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC⁽¹⁾
TLK105L,
TLK106L
RHB (VQFN)
UNIT
32 PINS
R_θJA
R_θJB
R_θJC(top)
R_θJC(bot)
Junction-to-ambient thermal resistance (no airflow), JEDEC high-K model
Junction-to-board thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-case (bottom) thermal resistance
36.4
°C/W
9.3
°C/W
26.8
°C/W
1.7
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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Electrical Specifications
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