CC2510_15 Datasheet, PDF (33/245 Pages) Texas Instruments – Low-Power SoC (System-on-Chip) with MCU, Memory,2.4 GHz RF Transceiver, and USB Controller

CC2511F8 - Not Recommended for New Designs
8.2 Radio
CC2510Fx/CC2511Fx features an RF transceiver
based on the industry-leading CC2500,
9 Application Circuit
Only a few external components are required
for using the CC2510Fx/CC2511Fx. The
recommended application circuit for CC2510Fx
is shown in Figure 10. The recommended
application circuits for CC2511Fx are shown in
Figure 11 and Figure 12. The first of the
9.1 Bias Resistor
The bias resistor R271 is used to set an
accurate bias current.
9.2 Balun and RF Matching
The balanced RF input and output of
CC2510Fx/CC2511Fx share two common pins and
are designed for a simple, low-cost matching
and balun network on the printed circuit board.
The RX- and TX switching at the
CC2510Fx/CC2511Fx front-end are controlled by a
dedicated on-chip function, eliminating the
need for an external RX/TX-switch.
A few passive external components combined
with the internal RX/TX switch/termination
circuitry ensures match in both RX and TX
mode.
Although CC2510Fx/CC2511Fx has a balanced
RF input/output, the chip can be connected to
a single-ended antenna with few external low
cost capacitors and inductors.
The passive matching/filtering network
connected to CC2510Fx/CC2511Fx should have
the following differential impedance as seen
from the RF-port (RF_P and RF_N) towards
the antenna:
Z_out = 80 + j74 Ω
9.3 Crystal
The crystal oscillator for the CC2510Fx uses an
external crystal X1, with two loading capacitors
(C201 and C211) (see Figure 10 and Table
28).
The CC2511Fx should use a 48 MHz
fundamental (X3) or a 48 MHz 3^rd overtone low
cost external crystal (X4). Depending on the
option selected, different loading capacitors
(C203 and C214 or C202, C212, and C213)
must be used. When X4 is used, an inductor
CC2510Fx / CC2511Fx
requiring very few external components. See
Section 13 for details.
recommended CC2511Fx circuit uses a
fundamental crystal and the second uses a 3^rd
overtone crystal. The external components are
described in Table 28, and typical values are
given in Table 29.
C232, C242, and two inductive transmission
PCB lines form the recommended balun that
converts the differential RF port on CC2510Fx to
a single-ended RF signal. For the CC2511Fx
balun, the inductive PCB lines are replaced by
L241 and L231. Note that either of the
solutions (PCB lines or discrete components)
can be used for both the chips. C241 and
C231 are needed for DC blocking. Together
with an appropriate LC filter network, the balun
components also transform the impedance to
match a 50 Ω antenna (or cable). Component
values for the RF balun and LC network are
found in the latest CC2510EM and
CC2511Dongle reference designs ([1] and [2]).
Suggested values are also listed in Table 29.
The balun and LC filter component values,
their placement and layout are important in
order to keep the performance of the
CC2510Fx/CC2511Fx optimized. It is highly
recommended to follow the CC2510EM /
CC2511Dongle reference designs. Gerber
files and schematics for the reference designs
are available for download from the TI website
(L281) must also be connected in series with
C212 (see Figure 11, Figure 12 and Table 28).
Note: The high speed crystal oscillator
must be stable (SLEEP.XOSC_STB=1)
before using the radio.
The recommended application circuits also
show the connections for an optional 32.768
kHz crystal oscillator with external crystal X2
SWRS055G
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