LSM6DSM Datasheet, PDF (15/113 Pages) STMicroelectronics – always-on 3D accelerometer and 3D gyroscope

LSM6DSM
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Overview
Overview
The LSM6DSM is a system-in-package featuring a high-performance 3-axis digital
accelerometer and 3-axis digital gyroscope.
The integrated power-efficient modes are able to reduce the power consumption down to
0.65 mA in high-performance mode, combining always-on low-power features with superior
sensing precision for an optimal motion experience for the consumer thanks to ultra-low
noise performance for both the gyroscope and accelerometer.
The LSM6DSM delivers best-in-class motion sensing that can detect orientation and
gestures in order to empower application developers and consumers with features and
capabilities that are more sophisticated than simply orienting their devices to portrait and
landscape mode.
The event-detection interrupts enable efficient and reliable motion tracking and contextual
awareness, implementing hardware recognition of free-fall events, 6D orientation, click and
double-click sensing, activity or inactivity, and wakeup events.
The LSM6DSM supports main OS requirements, offering real, virtual and batch mode
sensors. In addition, the LSM6DSM can efficiently run the sensor-related features specified
in Android, saving power and enabling faster reaction time. In particular, the LSM6DSM has
been designed to implement hardware features such as significant motion, tilt, pedometer
functions, timestamping and to support the data acquisition of an external magnetometer
with ironing correction (hard, soft).
The LSM6DSM offers hardware flexibility to connect the pins with different mode
connections to external sensors to expand functionalities such as adding a sensor hub,
auxiliary SPI, etc.
Up to 4 kbyte of FIFO with dynamic allocation of significant data (i.e. external sensors,
timestamp, etc.) allows overall power saving of the system.
The LSM6DSM gyroscope fully supports OIS/EIS applications. The module can output OIS
data through a dedicated auxiliary SPI and includes a dedicated configurable signal
processing path for OIS. OIS data can be sent directly to the application processor for data
processing. The gyroscope UI signal processing path is completely independent from that of
the OIS and is readable through FIFO.
Like the entire portfolio of MEMS sensor modules, the LSM6DSM leverages the robust and
mature in-house manufacturing processes already used for the production of
micromachined accelerometers and gyroscopes. The various sensing elements are
manufactured using specialized micromachining processes, while the IC interfaces are
developed using CMOS technology that allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the sensing element.
The LSM6DSM is available in a small plastic land grid array (LGA) package of
2.5 x 3.0 x 0.83 mm to address ultra-compact solutions.
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