LSM6DSM Datasheet, PDF (108/113 Pages) STMicroelectronics – always-on 3D accelerometer and 3D gyroscope

Soldering information
13 Soldering information
LSM6DSM
The LGA package is compliant with the ECOPACK^®, RoHS and "Green" standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com/mems.
108/113
DocID028165 Rev 2