LSM6DSM Datasheet, PDF (1/113 Pages) STMicroelectronics – always-on 3D accelerometer and 3D gyroscope

LSM6DSM
iNEMO inertial module:
always-on 3D accelerometer and 3D gyroscope
Datasheet - preliminary data
 EIS and OIS for camera applications
 Vibration monitoring and compensation
LGA-14L
(2.5 x 3 x 0.83 mm) typ.
Features
 Power consumption: 0.4 mA in combo normal mode
and 0.65 mA in combo high-performance mode
 “Always-on” experience with low power
consumption for both accelerometer and gyroscope
 Smart FIFO up to 4 kbyte based on features set
 Compliant with Android K, L, and M
 Hard, soft ironing for external magnetic sensor
corrections
 ±2/±4/±8/±16 g full scale
 ±125/±245/±500/±1000/±2000 dps full scale
 Analog supply voltage: 1.71 V to 3.6 V
 Independent IOs supply (1.62 V)
 Compact footprint, 2.5 mm x 3 mm x 0.83 mm
 SPI & I²C serial interface with main processor data
synchronization feature
 Dedicated gyroscope low-pass filters for UI and OIS
applications
 Auxiliary dedicated SPI for OIS data output
 Pedometer, step detector and step counter
 Significant motion and tilt function
 Standard interrupts: free-fall, wakeup, 6D/4D
orientation, click and double-click
 Embedded temperature sensor
 ECOPACK^®, RoHS and “Green” compliant
Applications
 Motion tracking and gesture detection
 Collecting sensor data
 Indoor navigation
 IoT and connected devices
 Intelligent power saving for handheld devices
Description
The LSM6DSM is a system-in-package featuring a 3D
digital accelerometer and a 3D digital gyroscope
performing at 0.65 mA in high-performance mode and
enabling always-on low-power features for an optimal
motion experience for the consumer.
The LSM6DSM supports main OS requirements,
offering real, virtual and batch sensors with 4 kbyte for
dynamic data batching.
ST’s family of MEMS sensor modules leverages the
robust and mature manufacturing processes already
used for the production of micromachined
accelerometers and gyroscopes.
The various sensing elements are manufactured using
specialized micromachining processes, while the IC
interfaces are developed using CMOS technology that
allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the
sensing element.
The LSM6DSM has a full-scale acceleration range of
±2/±4/±8/±16 g and an angular rate range of
±125/±245/±500/±1000/±2000 dps.
The LSM6DSM fully supports EIS and OIS applications
as the module includes a dedicated configurable signal
processing path for OIS and auxiliary dedicated low-
pass filtering.
High robustness to mechanical shock makes the
LSM6DSM the preferred choice of system designers for
the creation and manufacturing of reliable products.
The LSM6DSM is available in a plastic land grid array
(LGA) package.
Table 1. Device summary
Part number
Temp.
range [°C]
Package
Packing
LSM6DSM
LSM6DSMTR
-40 to +85
LGA-14L
-40 to +85 ^{(2.5x3x0.83mm)}
Tray
Tape &
Reel
February 2016
DocID028165 Rev 2
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
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