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| K4R881869M Datasheet, PDF (4/64 Pages) Samsung semiconductor – 288Mbit RDRAM 512K x 18 bit x 2*16 Dependent Banks Direct RDRAMTM | |||
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K4R881869M
Preliminary
Direct RDRAMâ¢
Pinouts and Definitions
Center-Bonded Devices - Preliminary
These tables shows the pin assignments of the center-bonded
RDRAM package. The mechanical dimensions of this
package are shown in a later section. Refer to Section
âCenter-Bonded uBGA Packageâ on page 58. Note - pin #1
is at the A1 position. .
Table 1: Center-Bonded Device (top view)
10
9
8
7
6
5
4
3
2
1
ROW
COL
VDD
GND
VDD
GND
VDD
VDD
VDD
VDD
GND
VDD
GND
VDD
VDD
DQA8
CMD
DQA7
VDD
DQA5
GND
DQA3
GNDa
DQA1
GNDa
CTMN
VDD
CTM
VDD
RQ7
GND
RQ5
GND
RQ3
VDD
RQ1
VDD
DQB1
GND
DQB3
GND
VCMOS
VDD
DQB5
DQB7
DQB8
GND
VDD
GND
VDD
GND
DQA6
DQA4
DQA2
DQA0
CFM
CFMN
RQ6
GND
SCK
VCMOS
GND
VDD
GND
VDDa
VREF
RQ4
GND
RQ2
VDD
RQ0
DQB0
DQB2
DQB4
DQB6
GND
GND
GND
VDD
SIO0
SIO1
GND
GND
VDD
VDD
GND
GND
VDD
GND
GND
GND
GND
GND
VDD
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
SAMSUNG 001
K4R88xx69A-Nxxx
Top View
Chip
The pin #1(ROW 1, COL A) is located at the
A1 position on the top side and the A1 position
is marked by the marker â â.
Page 2
Rev. 0.9 Jan. 2000
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