PIC18F2682 Datasheet, PDF (463/484 Pages) Microchip Technology – 28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology

PIC18F2682/2685/4682/4685
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
EXPOSED
D2
PAD
e
E
E2
b
2
2
1
1
N
NOTE 1
N
L
K
TOP VIEW
BOTTOM VIEW
A
A3
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
Number of Pins
N
44
Pitch
e
0.65 BSC
Overall Height
A
0.80
0.90
Standoff
A1
0.00
0.02
Contact Thickness
A3
0.20 REF
Overall Width
E
8.00 BSC
Exposed Pad Width
E2
6.30
6.45
Overall Length
D
8.00 BSC
Exposed Pad Length
D2
6.30
6.45
Contact Width
b
0.25
0.30
Contact Length
L
0.30
0.40
Notes:
Contact-to-Exposed Pad
K
0.20
–
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
Microchip Technology Drawing C04-103B
© 2007 Microchip Technology Inc.
Preliminary
DS39761B-page 461