PIC18F2682 Datasheet, PDF (462/484 Pages) Microchip Technology – 28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology

PIC18F2682/2685/4682/4685
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
1 23
NOTE 2
A
α
c
φ
β
A1
A2
L
L1
Number of Leads
Units
Dimension Limits
N
MILLIMETERS
MIN
NOM
MAX
44
Lead Pitch
Overall Height
Molded Package Thickness
e
0.80 BSC
A
–
–
1.20
A2
0.95
1.00
1.05
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
A1
0.05
–
0.15
L
0.45
0.60
0.75
L1
1.00 REF
φ
0°
3.5°
7°
E
12.00 BSC
D
12.00 BSC
Molded Package Width
Molded Package Length
Lead Thickness
E1
10.00 BSC
D1
10.00 BSC
c
0.09
–
0.20
Lead Width
b
0.30
0.37
0.45
Mold Draft Angle Top
α
11°
12°
13°
Notes:
Mold Draft Angle Bottom
β
11°
12°
13°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-076B
DS39761B-page 460
Preliminary
© 2007 Microchip Technology Inc.