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PIC32MX575F256H-80I Datasheet, PDF (172/236 Pages) Microchip Technology – High-Performance, USB, CAN and Ethernet 32-Bit Flash Microcontrollers | |||
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PIC32MX5XX/6XX/7XX
31.1 DC Characteristics
TABLE 31-1: OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)
Temp. Range
(in °C)
DC5
2.3-3.6V
-40°C to +85°C
Note 1: 40 MHz maximum for PIC32MX 40 MHz family variants.
Max. Frequency
PIC32MX5XX/6XX/7XX
80 MHz (Note 1)
TABLE 31-2: THERMAL OPERATING CONDITIONS
Rating
PIC32MX5XX/6XX/7XX
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD â S IOH)
I/O Pin Power Dissipation:
I/O = S ({VDD â VOH} x IOH) + S (VOL x IOL))
Maximum Allowed Power Dissipation
Symbol Min. Typical Max. Unit
TJ
-40
â
+125
°C
TA
-40
â
+85
°C
PD
PINT + PI/O
W
PDMAX
(TJ â TA)/ï±JA
W
TABLE 31-3: THERMAL PACKAGING CHARACTERISTICS
Characteristics
Symbol Typical Max.
Unit Notes
Package Thermal Resistance, 121-Pin XBGA (10x10x1.1 mm)
ï±JA
40
â
°C/W
1
Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm)
ï±JA
43
â
°C/W
1
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm)
ï±JA
43
â
°C/W
1
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm)
ï±JA
47
â
°C/W
1
Package Thermal Resistance, 64-Pin QFN (9x9x0,9 mm)
ï±JA
28
â
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (ï±JA) numbers are achieved by package simulations.
TABLE 31-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ï£ TA ï£ +85°C for Industrial
Param.
No.
Symbol
Characteristics
Min. Typical Max. Units
Conditions
Operating Voltage
DC10 Supply Voltage
VDD
2.3
â
3.6
DC12 VDR
RAM Data Retention Voltage
1.75
â
â
(Note 1)
DC16 VPOR
VDD Start Voltage
to Ensure Internal
Power-on Reset Signal
1.75
â
1.95
DC17 SVDD
VDD Rise Rate
to Ensure Internal
Power-on Reset Signal
0.00005
â
0.115
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
V
V
V
V/ïs
DS61156C-page 172
Preliminary
ï£ 2010 Microchip Technology Inc.
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