MC9328MX1_06 Datasheet, PDF (97/100 Pages) Freescale Semiconductor, Inc – MX Family of applications processors

Pin-Out and Package Information
5.1 MAPBGA 256 Package Dimensions
Figure 72 illustrates the 256 MAPBGA 14 mm × 14 mm × 1.30 mm package, with an 0.8 mm pad pitch.
The device designator for the MAPBGA package is VH.
Case Outline 1367
TOP VIEW
BOTTOM VIEW
SIDE VIEW
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2.INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14 5M-1994.
3.MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE IS DEFINED BY SPHERICAL CROWNS OF THE SOLDER BALLS.
Figure 72. i.MXL 256 MAPBGA Mechanical Drawing
MC9328MX1 Technical Data, Rev. 7
Freescale Semiconductor
97