MC908GR8CDWE Datasheet, PDF (388/408 Pages) Freescale Semiconductor, Inc – M68HC08 Microcontrollers

Freescale Semiconductor, Inc.
Mechanical Specifications
24.3 32-Pin LQFP (Case #873A)
A
A1
32
4X
0.20 (0.008) AB T-U Z
25
1
-T-
B
B1
8
9
DETAIL Y
9
-Z-
S1
S
-U-
V
V1
17
4X
0.20 (0.008) AC T-U Z
-AB-
Seating _-AC-
plane
8x M °
CE
DETAIL AD
G
0.10 (0.004) AC
Base Metal
N
F
D
R
J
Section AE–AE
H
K ^Q°
W
X
DETAIL AD
P
AE
AE
DETAIL Y
NOTES:
1. DIMENSIONS AND TOLERANCING AS PER ANSI
Y14.5M, 1982
2. CONTROLLING DIMENSION: MILLIMETER
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF
LEAD AND IS CONSISTENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT
DATUM PLANE -AB-
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -AC-
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -AB-
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020)
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003)
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
7.000 BSC
0.276 BSC
A1
3.500 BSC
0.138 BSC
B
7.000 BSC
0.276 BSC
B1
3.500 BSC
0.138 BSC
C
1.400 1.600 0.055 0.063
D
0.300 0.450 0.012 0.018
E
1.350 1.450 0.053 0.057
F
0.300 0.400 0.012 0.016
G
0.800 BSC
0.031 BSC
H
0.050 0.150 0.002 0.006
J
0.090 0.200 0.004 0.008
K
0.500 0.700 0.020 0.028
M
12° REF
12° REF
N
0.090 0.160 0.004 0.006
P
0.400 BSC
0.016 BSC
Q
1°
5°
1°
5°
R
0.150 0.250 0.006 0.010
S
9.000 BSC
0.354 BSC
S1
4.500 BSC
0.177 BSC
V
9.000 BSC
0.354 BSC
V1
4.500 BSC
0.177 BSC
W
0.200 REF
0.008 REF
X
1.000 REF
0.039 REF
Technical Data
388
MC68HC908GR8 — Rev 4.0
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA