MC908GR8CDWE Datasheet, PDF (387/408 Pages) Freescale Semiconductor, Inc – M68HC08 Microcontrollers

Freescale Semiconductor, Inc.
Technical Data — MC68HC908GR8
Section 24. Mechanical Specifications
24.1 Contents
24.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 387
24.3 32-Pin LQFP (Case #873A) . . . . . . . . . . . . . . . . . . . . . . . . . .388
24.4 28-Pin PDIP (Case #710) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 389
24.5 28-Pin SOIC (Case #751F). . . . . . . . . . . . . . . . . . . . . . . . . . . 390
24.2 Introduction
The MC68HC908GR8 is available in these packages:
• 32-pin low-profile quad flat pack (LQFP)
• 28-pin dual in-line package (PDIP)
• 28-pin small outline package (SOIC)
The package information contained in this section is the latest available
at the time of this publication. To make sure that you have the latest
package specifications, contact one of the following:
• Local Motorola Sales Office
• World Wide Web at http://www.motorola.com/semiconductors/
Follow World Wide Web on-line instructions to retrieve the current
mechanical specifications.
MC68HC908GR8 — Rev 4.0
MOTOROLA
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
Technical Data
387