MC68HC705CT4 Datasheet, PDF (144/152 Pages) Freescale Semiconductor, Inc – General Release Specification

Freescale Semiconductor, Inc.
Mechanical Specifications
18.3 44-Lead Plastic-Leaded Chip Carrier (Case 777-02)
-N-
D
Y BRK
-L-
-M-
B
0.007(0.180) ^M T L-M ^S N ^S
U
0.007(0.180) ^M T L-M ^S N ^S
Z
V
44
1
WD
X
VIEW D-D
G1
0.010 (0.25) ^S T L-M ^S N ^S
A
0.007(0.180) ^M T L-M ^S N ^S
R
Z
0.007(0.180) ^M T L-M ^S N ^S
H
0.007(0.180) ^M T L-M ^S N ^S
J
E
K1
C
G
0.004 (0.10)
-T- SEATING
K
PLANE
G1
VIEW S
0.010 (0.25) ^S T L-M ^S N ^S
F
0.007(0.180) ^M T L-M ^S N ^S
VIEW S
NOTES:
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSION R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETERMINED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
7. DIMINSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940146). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
INCHES
DIM MIN MAX
A 0.685 0.695
B 0.685 0.695
C 0.165 0.180
E 0.090 0.110
F 0.013 0.019
G
0.050 BSC
H 0.026 0.032
J 0.020
K 0.025
R 0.650 0.656
U 0.650 0.656
V 0.042 0.048
W 0.042 0.048
X 0.042 0.056
Y
0.020
Z
2°
10°
G1 0.610 0.630
K1 0.040
MILLIMETERS
MIN MAX
17.40 17.65
17.40 17.65
4.20 4.57
2.29 2.79
0.33 0.48
1.27 BSC
0.66 0.81
0.51
0.64
16.51 16.66
16.51 16.66
1.07 1.21
1.07 1.21
1.07 1.42
0.50
2°
10°
15.50 16.00
1.02
General Release Specification
MC68HC705CT4 — Rev. 2.0
144
Mechanical Specifications
MOTOROLA
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