MC68HC711D3_05 Datasheet, PDF (121/138 Pages) Freescale Semiconductor, Inc – Microcontrollers

Chapter 10
Ordering Information and Mechanical Specifications
10.1 Introduction
This section provides ordering information for the MC68HC711D3. In addition, mechanical specifications
are provided for the following packaging options:
• 40-pin plastic dual in-line package (DIP)
• 44-pin plastic leaded chip carrier (PLCC)
• 44-pin plastic quad flat pack (QFP)
10.2 Ordering Information
Table 10-1. MC Order Numbers
Package Type
40-pin DIP
44-pin PLCC
44-pin QFP
Temperature
–40 to +85°C
–40 to +85°C
–40 to +105°C
–40 to +85°C
MC Order Number
2 MHz
3 MHz
MC68HC711D3CP2
MC68HC711D3CP3
MC68HC711D3CFN2
MC68HC711D3CFN3
MC68HC711D3VFN2
MC68HC711D3VFN3
MC68HC711D3CFB2
MC68HC711D3CFB3
10.3 40-Pin DIP (Case 711-03)
40
1
H
A
G
F
21
B
20
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 51.69 52.45 2.035 2.065
B 13.72 14.22 0.540 0.560
C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
F 1.02 1.52 0.040 0.060
G
2.54 BSC
0.100 BSC
H 1.65 2.16 0.065 0.085
J 0.20 0.38 0.008 0.015
K 2.92 3.43 0.115 0.135
L 15.24 BSC
0.600 BSC
M
0 _° 15_°
0_° 15_°
N 0.51 1.02 0.020 0.040
MC68HC711D3 Data Sheet, Rev. 2.1
Freescale Semiconductor
121