C-3E Datasheet, PDF (107/114 Pages) Freescale Semiconductor, Inc – C-3e NETWORK PROCESSOR SILICON REVISION A1

Reflow
Reflow 107
Typical Reflow Profile for the C-3e Switch Module comprises:
1 Follow the guidelines recommended by your solder paste supplier.
Flux requirements must be met for best solderability.
2 The temperature profile should be carefully characterized to ensure uniform
temperature across the board and package.
Solder ball voiding may be affected by ramp rates and dwell times below and above
liquids.
3 A nitrogen atmosphere is not required, but will make the process more robust. It can
make a difference for marginally solderable PC board pads.
4 Full convection forced air furnaces work best, but IR, Convection/IR, or vapor phase can
be used.
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