C-3E Datasheet, PDF (106/114 Pages) Freescale Semiconductor, Inc – C-3e NETWORK PROCESSOR SILICON REVISION A1

106 CHAPTER 4: MECHANICAL SPECIFICATIONS
Package Measurements
Table 57 defines the C-3e NP package measurements, providing nominal, minimum, and
maximum sizes where appropriate.
Table 57 Package Measurements (Reference Figure 28, Figure 29 and Figure 30 for Symbols)
SYMBOL
A
A₁
A₂
A₃
A₄
D
D₁
E
E₁
e
b
DEFINITION
Overall
Ball height
C4 and Die
Body thickness
Capacitor pad
Body size
Ball footprint (X)
Body size
Ball footprint (Y)
Ball pitch
Ball diameter
NOM. (MM)
3.11
0.70
0.86
1.55
29.00
26.00
29.00
26.00
1.00
0.70
MIN. (MM)
2.83
0.6
MAX. (MM)
3.39
0.8
1.41
28.80
1.69
0.6
29.20
28.80
29.20
At Motorola’s discretion up to fourteen (14) capacitors may or may not be attached on
the top of the package.
Marking Codes
Table 58 explains the marking on the C-3e NP.
Table 58 C-3e Network Processor Marking Codes
MARKING (EXPLANATION OF CODES)
Top
Logo/Part#/Date Code
Bottom
N/A
Pin 1 Marking
Chamfered Corner
C3EN