XC2V4000 Datasheet, PDF (87/311 Pages) Xilinx, Inc – Summary of Features

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Virtex™-II Platform FPGAs:
Pinout Information
DS031-4 (v2.0) August 1, 2003
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This document provides Virtex-II Device/Package Combi-
nations and Maximum I/Os Available and Virtex-II Pin
Definitions, followed by pinout tables for the following pack-
ages:
• CS144 Chip-Scale BGA Package
• FG256 Fine-Pitch BGA Package
• FG456 Fine-Pitch BGA Package
• FG676 Fine-Pitch BGA Package
• BG575 Standard BGA Package
• BG728 Standard BGA Package
• FF896 Flip-Chip Fine-Pitch BGA Package
• FF1152 Flip-Chip Fine-Pitch BGA Package
• FF1517 Flip-Chip Fine-Pitch BGA Package
• BF957 Flip-Chip BGA Package
For device pinout diagrams and layout guidelines, refer to
the Virtex-II Platform FPGA User Guide. ASCII package
pinout files are also available for download from the Xilinx
website (www.xilinx.com).
Virtex-II Device/Package Combinations
and Maximum I/Os Available
Wire-bond and flip-chip packages are available. Table 1 and
Table 2 show the maximum number of user I/Os possible in
wire-bond and flip-chip packages, respectively.
Table 3 shows the number of user I/Os available for all
device/package combinations.
• CS denotes wire-bond chip-scale ball grid array (BGA)
(0.80 mm pitch).
• FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).
• FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).
• BG denotes standard BGA (1.27 mm pitch).
• BF denotes flip-chip BGA (1.27 mm pitch).
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, AND RSVD).
Table 1: Wire-Bond Packages Information
Package
CS144
FG256
FG456
FG676
BG575
BG728
Pitch (mm)
0.80
1.00
1.00
1.00
1.27
1.27
Size (mm)
12 x 12
17 x 17
23 x 23
27 x 27
31 x 31
35 x 35
I/Os
92
172
324
484
408
516
Table 2: Flip-Chip Packages Information
Package
FF896
Pitch (mm)
1.00
Size (mm)
31 x 31
I/Os
624
FF1152
1.00
35 x 35
824
FF1517
1.00
40 x 40
1,108
BF957
1.27
40 x 40
684
© 2001-2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS031-4 (v2.0) August 1, 2003
Product Specification
www.xilinx.com
1-800-255-7778
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