XC2V4000 Datasheet, PDF (49/311 Pages) Xilinx, Inc – Summary of Features

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Virtex™-II Platform FPGAs:
DC and Switching Characteristics
DS031-3 (v3.0) August 1, 2003
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Virtex-II Electrical Characteristics
Virtex-II devices are provided in –4, –5, and –6 speed
grades, with –6 having the highest performance.
Virtex-II DC and AC characteristics are specified for both
commercial and industrial grades. Except the operating tem-
perature range or unless otherwise noted, all the DC and AC
electrical parameters are the same for a particular speed
grade (that is, the timing characteristics of a –4 speed grade
industrial device are the same as for a –4 speed grade com-
Virtex-II DC Characteristics
mercial device). However, only selected speed grades
and/or devices might be available in the industrial range.
All supply voltage and junction temperature specifications
are representative of worst-case conditions. The parame-
ters included are common to popular designs and typical
applications. Contact Xilinx for design considerations
requiring more detailed information.
All specifications are subject to change without notice.
Table 1: Absolute Maximum Ratings
Symbol
Description⁽¹⁾
Units
V_CCINT Internal supply voltage relative to GND
–0.5 to 1.65
V
V_CCAUX Auxiliary supply voltage relative to GND
–0.5 to 4.0
V
V_CCO Output drivers supply voltage relative to GND
–0.5 to 4.0
V
V_BATT Key memory battery backup supply
–0.5 to 4.0
V
V_REF
V_IN ⁽³⁾
Input reference voltage
Input voltage relative to GND (user and dedicated I/Os)
–0.5 to V_CCO + 0.5
V
–0.5 to V_CCO + 0.5
V
V_TS
Voltage applied to 3-state output (user and dedicated I/Os)
–0.5 to 4.0
V
T_STG Storage temperature (ambient)
–65 to +150
°C
T_SOL
T_J
Maximum soldering temp.
Operating junction temperature ⁽²⁾
+220
°C
+125
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website.
3. Inputs configured as PCI are fully PCI compliant. This statement takes precedence over any specification that would imply that the
device is not PCI compliant.
© 2001-2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS031-3 (v3.0) August 1, 2003
Product Specification
www.xilinx.com
1-800-255-7778
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