XC2V4000 Datasheet, PDF (205/311 Pages) Xilinx, Inc – Summary of Features

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Virtex™-II Platform FPGAs: Pinout Information
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 7: FF896 Flip-Chip Fine-Pitch BGA Package Specifications
DS031-4 (v2.0) August 1, 2003
Product Specification
www.xilinx.com
1-800-255-7778
Module 4 of 4
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