DS90UH948-Q1 Datasheet, PDF (88/91 Pages) Texas Instruments – FPD-Link III to OpenLDI Deserializer

NKD0064A
B
SCALE 1.600
9.1
8.9
PACKAGE OUTLINE
WQFN - 0.8 mm max height
WQFN
A
PIN 1 INDEX AREA
0.8 MAX
SEE TERMINAL
DETAIL
17
16
7.2 0.1
0.5
0.3
9.1
0.3
8.9
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
C
SEATING PLANE
32
33
60X 0.5
(0.1)
TYP
4X
7.5
1
PIN 1 ID
64
(OPTIONAL)
48
49
64X
0.5
0.3
64X
0.3
0.2
0.1 C A B
0.05 C
4214996/A 08/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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