DS90UH948-Q1 Datasheet, PDF (83/91 Pages) Texas Instruments – FPD-Link III to OpenLDI Deserializer

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12 Device and Documentation Support
DS90UH948-Q1
SNLS473A – OCTOBER 2014 – REVISED JANUARY 2016
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
• Soldering Specifications Application Report, SNOA549
• IC Package Thermal Metrics Application Report, SPRA953
• Channel-Link PCB and Interconnect Design-In Guidelines, SNLA008
• Transmission Line RAPIDESIGNER Operation and Application Guide, SNLA035
• Leadless Leadframe Package (LLP) Application Report, SNOA401
• LVDS Owner's Manual, SNLA187
• I2C Communication Over FPD-Link III with Bidirectional Control Channel, SNLA131
• Using the I2S Audio Interface of DS90Ux92x FPD-Link III Devices, SNLA221
• Exploring the Internal Test Pattern Generation Feature of 720p FPD-Link III Devices, SNLA132
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2014–2016, Texas Instruments Incorporated
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