TMDS171 Datasheet, PDF (6/62 Pages) Texas Instruments – 3.4 Gbps TMDS RETIMER

TMDS171, TMDS171I
SLLSEN7A – OCTOBER 2015 – REVISED DECEMBER 2015
www.ti.com
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
V_DD
T_STG
T_CASE
T_A
Supply Voltage Nominal Value 3.3 V
Supply Voltage Nominial Value 1.2 V
Storage temperature
Case temperature
Operating free-air temperature (TMDS171)
Operating free-air temperature (TMDS171I)
MAIN LINK DIFFERENTIAL PINS
V_ID(PP)
Peak-to-peak input differential voltage
V_IC
Input Common Mode Voltage
d_R
Data rate
R_(VSADJ)
TMDS compliant swing voltage bias resistor 1%
DDC, I2C, HPD, AND CONTROL PINS
V_I(DC)
DC Input Voltage
HDP_SNK, SDA_SNK, SCL_SNK,
SDA_SRC, SCL_SRC
All other Local I²C, and control pins
Low-level input voltage HPD
V_IL
Low-level input voltage at DDC/I2C
Low-level input voltage at PRE_SEL, EQ_SEL/A0, TX_TERM_CTL,
SWAP/POL pins only⁽¹⁾
V_IM
Mid-Level input voltage at PRE_SEL, EQ_SEL/A0, TX_TERM_CTL,
SWAP/POL pins only⁽¹⁾
High-level input voltage at HPD
High-level input voltage at I²C and SDA_SRC, SCL_SRC
V_IH
High-level input voltage at SDA_SNK, SCL_SNK
High-level input voltage at PRE_SEL, EQ_SEL/A0, TX_TERM_CTL,
SWAP/POL pins only⁽¹⁾
V_OL
Low-level output voltage
V_OH
High-level output voltage
f_SCL
SCL clock frequency fast I²C mode for local I²C control
C_bus
Total capacitive load for each bus line (DDC and local I²C terminals)
d_R(DDC)
I_IH
I_IL
I_OS
I_OZ
R_(OEPU)
DDC Data rate
High level input current
Low level input current
Short circuit output current
High impedance output current
Pull up resistance on OE pin
MIN
3.135
1.1
–65
0
–40
75
VCC – 0.4
0.25
–0.3
–0.3
1
2
1.8
2.8
2.6
2.4
30
–25
–50
150
NOM
3.3
1.2
MAX
3.465
1.27
150
92.7
85
85
UNIT
V
V
°C
°C
°C
°C
1560
VCC + 0.1
3.4
7.06
mVpp
V
Gbps
KΩ
5.5
V
3.6
V
0.8
V
0.3 x V_CC
V
0.3
V
1.2
1.4
V
V
V
V
0.4
V
V
400
kHz
400
pF
100
400
kbps
30
µA
25
µA
50
mA
10
µA
250
KΩ
(1) These values are based upon a microcontroller driving the control pins. The pull up/down/floating resistor configuration will set control
pins properly which will have a different value than shown due to internal biasing.
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
RGZ (QFN)
48 PINS
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
31.1
18.2
8.1
°C/W
0.4
8.1
3.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6
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