SM320C6727B-EP Datasheet, PDF (106/109 Pages) Texas Instruments – Floating-Point Digital Signal Processor

SM320C6727B-EP
SPRS793A – SEPTEMBER 2011 – REVISED OCTOBER 2011
6 Mechanical Data
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6.1 Package Thermal Resistance Characteristics
Table 6-1 provides the thermal characteristics for the recommended package type used on the
SM320C6727B DSP.
Table 6-1. Thermal Characteristics for GDH Package
NO.
1
Rθ_JA
2
Rθ_JB
3
Rθ_JC
4
Ψ_JB
5
Ψ_JT
Two-Signal, Two-Plane, 101.5 x 114.5 x 1.6 mm , 2-oz Cu. EIA/JESD51-9 PCB
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Board
Thermal Resistance Junction to Top of Case
Thermal Metric Junction to Board
Thermal Metric Junction to Top of Case
°C/W
25
14.5
10
14
0.39
AIR FLOW
(m/s)
0
0
0
0
0
6.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device. This data is subject to change without notice and without revision of this document.
106 Mechanical Data
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