243658-020 Datasheet, PDF (95/128 Pages) Intel Corporation – Intel Celeron Processor up to 1.10 GHz

Intel^® Celeron^® Processor up to 1.10 GHz
Table 53. Package Dimensions (FC-PGA2 Package)
Symbol
A1
A2
B1
B2
C1
C2
D
D1
G1
G2
G3
H
L
ΦP
Pin TP
Millimeters
Minimum
Maximum
Notes
2.266
2.690
0.980
1.180
30.800
31.200
30.800
31.200
33.000 max
33.000 max
49.428
49.632
45.466
45.974
0.000
17.780
0.000
17.780
0.000
0.889
2.540
Nominal
3.048
3.302
0.431
0.483
0.508 Diametric True Position (Pin-to-Pin)
Inches
Minimum
Maximum
Notes
0.089
0.106
0.038
0.047
1.212
1.229
1.212
1.229
1.299 max
1.299 max
1.946
1.954
1.790
1.810
0.000
0.700
0.000
0.700
0.000
0.035
0.100
Nominal
0.120
0.130
0.017
0.019
0.020 Diametric True Position (Pin-to-Pin)
NOTE: Capacitors will be placed on the pin-side of the FC-PGA2 package in the area defined by G1, G2, and
G3. This area is a keepout zone for motherboard designers.
For Table 52, the following apply:
1. It is not recommended to use any portion of the processor substrate as a mechanical reference
or load bearing surface for thermal solutions.
2. Parameters assume uniformly applied loads.
Table 54. Processor Case Loading Parameters (FC-PGA2 Package)
Parameter
Dynamic (max)¹ Static (max)^2,3
Unit
IHS Surface
IHS Edge
IHS Corner
200
100
lbf
125
N/A
lbf
75
N/A
ibf
NOTES:
1. This specification applies to a uniform and a non-uniform load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. See socket manufacturer’s force loading specification also to ensure compliance. Maximum static loading
listed here does not account for the maximum reaction forces on the socket tabs or pins.
Datasheet
95