243658-020 Datasheet, PDF (8/128 Pages) Intel Corporation – Intel Celeron Processor up to 1.10 GHz

Intel^® Celeron^® Processor up to 1.10 GHz
32 AGTL+ Signal Groups Ringback Tolerance Specifications at the
Processor Pins (For FC-PGA/FC-PGA2 Packages) ........................................... 55
33 AGTL+ Signal Groups Ringback Tolerance Guidelines for Edge Finger
Measurement on the S.E.P. Package ................................................................. 56
34 Signal Ringback Specifications for Non-AGTL+ Signal Simulation at the
Processor Core (S.E.P. and PPGA Packages)................................................... 58
35 Signal Ringback Guidelines for Non-AGTL+ Signal Edge Finger
Measurement (S.E.P. Package).......................................................................... 58
36 Signal Ringback Specifications for Non-AGTL+ Signal Simulation at the
Processor Pins (FC-PGA/FC-PGA2 Packages).................................................. 58
37 Example Platform Information............................................................................. 61
38 66 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance at
Processor Pins (FC-PGA/FC-PGA2 Packages).................................................. 62
39 33 MHz CMOS Signal Group Overshoot/Undershoot Tolerance at
Processor Pins (FC-PGA/FC-PGA2 Packages).................................................. 63
40 Processor Power for the PPGA and FC-PGA Packages .................................... 66
41
Intel^® Celeron^® Processor for the FC-PGA2 Package Thermal Design Power . 67
42 Thermal Diode Parameters (S.E.P. and PPGA Packages)................................. 68
43 Thermal Diode Parameters (FC-PGA/FC-PGA2 Packages)............................... 68
44 Thermal Diode Interface...................................................................................... 68
45 S.E.P. Package Signal Listing by Pin Number.................................................... 71
46 S.E.P. Package Signal Listing by Signal Name .................................................. 75
47 Package Dimensions (PPGA Package) .............................................................. 80
48 Information Summary (PPGA Package) ............................................................. 80
49 PPGA Package Signal Listing by Pin Number .................................................... 82
50 PPGA Package Signal Listing in Order by Signal Name .................................... 87
51 Package Dimensions (FC-PGA Package) .......................................................... 93
52 Processor Die Loading Parameters (FC-PGA Package) .................................... 93
53 Package Dimensions (FC-PGA2 Package) ........................................................ 95
54 Processor Case Loading Parameters (FC-PGA2 Package) ............................... 95
55 FC-PGA/FC-PGA2 Signal Listing in Order by Signal Name ............................... 98
56 FC-PGA/FC-PGA2 Signal Listing in Order by Pin Number ............................... 103
57 Boxed Processor Fan Heatsink Spatial Dimensions for the S.E.P. Package ... 112
58 Fan Heatsink Power and Signal Specifications................................................. 118
59 Alphabetical Signal Reference .......................................................................... 120
60 Output Signals................................................................................................... 126
61 Input Signals ..................................................................................................... 127
62 Input/Output Signals (Single Driver).................................................................. 128
63 Input/Output Signals (Multiple Driver) ............................................................... 128
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Datasheet