243658-020 Datasheet, PDF (65/128 Pages) Intel Corporation – Intel Celeron Processor up to 1.10 GHz

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Intel^® Celeron^® Processor up to 1.10 GHz
Thermal Specifications and Design Considerations
This section provides needed data for designing a thermal solution. However, for the correct
thermal measuring processes, refer to AP-905, Intel^® Pentium^® III Processor Thermal Design
Guidelines (Order Number 245087). For the FC-PGA/FC-PGA2 using flip chip pin grid array
packaging technology, Intel specifies the junction temperature (T_junction). For the S.E.P. package
and PPGA package, Intel specifies the case temperature (T_case).
Thermal Specifications
Table 40 provides both the Processor Power and Heatsink Design Target for Celeron processors.
Processor Power is defined as the total power dissipated by the processor core and its package.
Therefore, the S.E.P. Package’s Processor Power would also include power dissipated by the
AGTL+ termination resistors. The overall system chassis thermal design must comprehend the
entire Processor Power. The Heatsink Design Target consists of only the processor core, which
dissipates the majority of the thermal power.
Systems should design for the highest possible thermal power, even if a processor with a lower
thermal dissipation is planned. The processor’s heatslug is the attach location for all thermal
solutions. The maximum and minimum case temperatures are also specified in Table 40. A thermal
solution should be designed to ensure the temperature of the case never exceeds these
specifications. Refer to the Intel developer Web site at http://developer.intel.com for more
information.
Datasheet
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