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243658-020 Datasheet, PDF (12/128 Pages) Intel Corporation – Intel Celeron Processor up to 1.10 GHz | |||
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Intel® Celeron® Processor up to 1.10 GHz
1.1.1
Package Terminology
The following terms are used often in this document and are explained here for clarification:
⢠Processor substrateâThe structure on which passive components (resistors and capacitors)
are mounted.
⢠Processor coreâThe processorâs execution engine.
⢠S.E.P. PackageâSingle-Edge Processor Package, which consists of a processor substrate,
processor core, and passive components. This package differs from the S.E.C. Cartridge as this
processor has no external plastic cover, thermal plate, or latch arms.
⢠PPGA packageâPlastic Pin Grid Array package. The package is a pinned laminated printed
circuit board structure.
⢠FC-PGA â Flip-Chip Pin Grid Array. The FC-PGA uses the same 370-pin zero insertion
force socket (PGA370) as the PPGA. Thermal solutions are attached directly to the back of the
processor core package without the use of a thermal plate or heat spreader.
⢠FC-PGA2 â Flip Chip Pin Grid Array 2. The FC-PG2A uses the same 370-pin zero insertion
force socket (PGA370) as the PPGA. The FC-PGA2 package contains an Integrated Heat
Spreader that covers the processor die.
⢠Keepout zone - The area on or near a FC-PGA/FC-PGA2 packaged processor that system
designs can not utilize.
⢠Keep-in zone - The area of a FC-PGA packaged processor that thermal solutions may utilize.
Additional terms referred to in this and other related documentation:
⢠SC242â242-contact slot connector. A processor in the S.E.P. Package uses this connector to
interface with a system board.
⢠370-pin socket (PGA370)âThe zero insertion force (ZIF) socket in which a processor in the
PPGA package will use to interface with a system board.
⢠Retention mechanismâA mechanical assembly which holds the package in the SC242
connector.
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Datasheet
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