243658-020 Datasheet, PDF (4/128 Pages) Intel Corporation – Intel Celeron Processor up to 1.10 GHz

Intel^® Celeron^® Processor up to 1.10 GHz
3.4.5 Reading Overshoot/Undershoot Specification Tables
(FC-PGA/FC-PGA2 Packages) .............................................................. 61
3.4.6 Determining if a System meets the Overshoot/Undershoot
Specifications (FC-PGA/FC-PGA2 Packages)....................................... 62
3.5 Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 64
4.0
Thermal Specifications and Design Considerations......................................................... 65
4.1 Thermal Specifications........................................................................................ 65
4.1.1 Thermal Diode........................................................................................ 68
5.0
Mechanical Specifications................................................................................................ 69
5.1 S.E.P. Package ................................................................................................... 69
5.1.1 Materials Information.............................................................................. 69
5.1.2 Signal Listing (S.E.P. Package) ............................................................ 70
5.2 PPGA Package ................................................................................................... 79
5.2.1 PPGA Package Materials Information.................................................... 79
5.2.2 PPGA Package Signal Listing ................................................................ 81
5.3 FC-PGA/FC-PGA2 Packages ............................................................................. 92
5.3.1 FC-PGA Mechanical Specifications ....................................................... 92
5.3.2 Mechanical Specifications (FC-PGA2 Package) .................................... 94
5.3.2.1 Recommended Mechanical Keep-Out Zones
(FC-PGA2 Package) ................................................................. 96
5.3.3 FC-PGA/FC-PGA2 Package Signal List................................................. 97
5.4 Processor Markings (PPGA/FC-PGA/FC-PGA2 Packages) ............................. 108
5.5 Heatsink Volumetric Keepout Zone Guidelines................................................. 109
6.0
Boxed Processor Specifications..................................................................................... 110
6.1 Mechanical Specifications for the Boxed Intel^® Celeron^® Processor ................ 110
6.1.1 Mechanical Specifications for the S.E.P. Package............................... 110
6.1.1.1 Boxed Processor Heatsink Weight.......................................... 112
6.1.1.2 Boxed Processor Retention Mechanism ................................. 112
6.1.2 Mechanical Specifications for the PPGA Package............................... 113
6.1.2.1 Boxed Processor Heatsink Weight.......................................... 114
6.1.3 Mechanical Specifications for the FC-PGA/FC-PGA2 Packages......... 114
6.1.3.1 Boxed Processor Heatsink Weight.......................................... 115
6.2 Thermal Specifications...................................................................................... 115
6.2.1 Thermal Requirements for the Boxed Intel^® Celeron^® Processor........ 115
6.2.1.1 Boxed Processor Cooling Requirements ................................ 115
6.2.1.2 Boxed Processor Thermal Cooling Solution Clip .................... 117
6.3 Electrical Requirements for the Boxed Intel^® Celeron^® Processor ................... 117
6.3.1 Electrical Requirements ....................................................................... 117
7.0
Processor Signal Description ......................................................................................... 120
7.1 Signal Summaries ............................................................................................. 126
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Datasheet