243658-020 Datasheet, PDF (66/128 Pages) Intel Corporation – Intel Celeron Processor up to 1.10 GHz

Intel^® Celeron^® Processor up to 1.10 GHz
Table 40. Processor Power for the PPGA and FC-PGA Packages
Processor
Core
Frequency
333 MHz
366 MHz
400 MHz
433 MHz
466 MHz
500 MHz
533 MHz
533A³ MHz
566³ MHz
600³ MHz
633 MHz
667 MHz
700 MHz
733 MHz
766 MHz
800 MHz
850 MHz
900 MHz
950 MHz
1 GHz
1.10 GHz
L2
Cache
Size
(KB)
128
128
128
128
128
128
128
128
128
128
128
128
128
128
128
128
128
128
128
128
128
Processor
Thermal
Design
Power^2,3
(W) up to
CPUID
0686h
Processor
Thermal
Design
Power^2,3
(W) for
CPUID
068Ah
Power
Density ⁵
(W/cm²)
For
CPUID
0686h
19.7
NA
NA
21.7
NA
NA
23.7
NA
NA
24.1
NA
NA
25.6
NA
NA
27.0
NA
NA
28.3
14.0^4,7
14.9^4,8
15.8^4,9
16.5⁴
17.5⁴
18.3⁴
19.1⁴
20.0⁴
20.8⁴
22.5⁴
NA
NA
NA
NA
NA
NA
19.2
19.6⁴
20.2⁴
21.1⁴
21.9⁴
22.8⁴
23.6⁴
24.5⁴
25.7⁴
26.7⁴
28.0
29.0
33.0
NA
17.5⁴
18.5⁴
19.7⁴
25.8⁴
27.3⁴
28.6⁴
29.8⁴
31.3⁴
32.6⁴
35.2⁴
NA
NA
NA
NA
Power
Density ⁵
(W/cm²)
For
CPUID
068Ah
NA
NA
NA
NA
NA
NA
NA
NA
30⁴
30.5⁴
31.5⁴
32.9⁴
34.1⁴
35.5⁴
36.8⁴
38.2⁴
40.0⁴
41.6⁴
43.6⁴
45.2⁴
51.4⁴
Min
TCASE
(°C)
5
5
5
5
5
5
5
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
Max
TCASE
(°C)
Max¹⁰
T_JUNCTION
(°C)
TO_{JUfNfsCeTtIO6N}
(°C)
85
NA
NA
85
NA
NA
85
NA
NA
85
NA
NA
70
NA
NA
70
NA
NA
70
NA
NA
NA
90
2.6
NA
90
2.6
NA
90
2.6
NA
82
2.6
NA
82
2.6
NA
80
2.7
NA
80
2.8
NA
80
3.0
NA
80
3.0
NA
80
3.3
NA
77
3.6
NA
79
3.8
NA
75
3.8
NA
77
4.4
NOTES:
1. These values are specified at nominal VCCCORE for the processor core.
2. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to
dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum T_JUNCTION specification.
3. FC-PGA package only.
4. The Thermal Design Power (TDP) Celeron^® processors in production has been redefined. The updated TDP
values are based on device characterization and do not reflect any silicon design changes to lower processor
power consumption. The TDP values represent the thermal design point required to cool Celeron^®
processors in the platform environment while executing thermal validation type software.
5. Power density is the maximum power the processor die can dissipate (i.e., processor power) divided by the
die area over which the power is generated. Power for these processors is generated from the core area
shown in Figure 17.
6. T_{junctionoffset} is the worst-case difference between the thermal reading from the on-die thermal diode and the
hottest location on the processor’s core. T_{junctionoffset} values do not include any thermal diode kit
measurement error. Diode kit measurement error must be added to the T_{junctionoffset} value from the table.
Intel has characterized the use of the Analog Devices AD1021 diode measurement kit and found its
measurement error to be ±1 ^oC.
7. For processors with a CPUID of 0683h, the TDP number is 11.2 W.
8. For processors with a CPUID of 0683h, the TDP number is 11.9 W.
9. For processors with a CPUID of 0683h, the TDP number is 12.6 W.
10.The Tj min for processors with a CPUID of 068x is 0 ^oC with a 3 ^oC– 5 ^oC margin error.
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Datasheet