82551QM Datasheet, PDF (114/120 Pages) Intel Corporation – Fast Ethernet Multifunction PCI/CardBus Controller

82551QM — Networking Silicon
Figure 32. 196 PBGA Package Pad Detail
Detail Area
0.45
Solder Resist Opening
0.60
Metal Diameter
As illustrated in Figure 32, the 82551QM package uses solder mask defined pads. The copper area
is 0.60 mm and the opening in the solder mask is 0.45 mm. The nominal ball sphere diameter is
0.50 mm.
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Datasheet