82551QM Datasheet, PDF (113/120 Pages) Intel Corporation – Fast Ethernet Multifunction PCI/CardBus Controller

Networking Silicon — 82551QM
14.0 Package and Pinout Information
14.1
Package Information
The 82551QM is a 196-pin Ball Grid Array (BGA) package. Package dimensions are shown in
Figure 31. More information on Intel^® device packaging is available in the Intel Packaging
Handbook.
Figure 31. Dimension Diagram for the 196-pin BGA
1.56 +/-0.19
0.85
30 ^o
0.32 +/-0.04
0.40 +/-0.10
Seating Plate
Note: All dimensions are in millimeters.
Substrate change from
0.36 mm to 0.32 mm
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
Datasheet
107