PXS30 Datasheet, PDF (96/139 Pages) Freescale Semiconductor, Inc – PXS30 Microcontroller

Electrical characteristics
Table 45. PDI pads AC electrical specifications (V_{DD_HV_PDI} = 1.8 V)
No.
Name
Prop. Delay (ns)
L  H/H  L¹
Min
Max
Rise/Fall Edge
(ns)
Min
Max
Drive Load
(pF)
Drive/Slew
Rate Select
MSB, LSB
1
PDI Medium
—
5.5/3.5
2/1
—
50
11
12/5.5
7.2/2.3
200
49/17
13/6
50
10
60/23
21/9.2
200
102/32
26/12
50
01
2
PDI Fast
119/39
35/16
200
722/216
172/85
50
00
772/237
191/90
200
—
10/10
2/2
—
50
11
15/15
15/15
22/22
24/24
33/33
6.2/6.2
4.5/4.5
7.1/7.1
7.5/7.5
12/12
200
50
10
200
50
01
200
66/66
24/24
50
00
84/84
31/31
200
NOTES:
1 _{L  H signifies low-to-high propagation delay and H  L signifies high-to-low propagation delay.}
3.19 DRAM pad specifications
This section specifies the electrical characteristics of the DRAM pads. Please refer to the tables in
Section 2.2, Pin descriptions,” for a cross reference between package pins and pad types.
DRAM pads feature list:
• Driver
— Configurable to support LPDDR half strength, LPDDR full strength, DDR1, DDR2 half
strength, DDR2 full strength, and SDR modes.
— VDD_HV_DRAM Range of
– 1.8 V nominal
– 2.5 V nominal
– 3.3 V nominal
• Receiver
— Differential or pseudo-differential input buffer in all DRAM pads
PXS30 Microcontroller Data Sheet, Rev. 1
96
Preliminary—Subject to Change Without Notice
Freescale Semiconductor