PXS30 Datasheet, PDF (138/139 Pages) Freescale Semiconductor, Inc – PXS30 Microcontroller

Document revision history
8. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
9. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled
Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.
10. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.
212–220.
7 Document revision history
Table 77 summarizes revisions to this document.
Table 77. Revision history
Revision
Date
1
30 Sep 2011 Initial release.
Description of Changes
PXS30 Microcontroller Data Sheet, Rev. 1
138
Preliminary—Subject to Change Without Notice
Freescale Semiconductor