MC68HC705P9 Datasheet, PDF (151/160 Pages) Motorola, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Technical Data — MC68HC705P9
Section 14. Ordering Information
14.1 Contents
14.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
14.3 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .151
14.2 Introduction
This section contains ordering numbers for the MC68HC705P9.
14.3 MC Order Numbers
Table 14-1. Order Numbers
Package
Type
Case
Pin
Outline Count
Plastic DIP⁽¹⁾
710
28
SOIC⁽²⁾
733
28
CERDIP⁽³⁾
751F
28
1. DIP = dual in-line package
2. SOIC = small outline integrated circuit
3. CERDIP = ceramic DIP
Operating
Temperature
0 to +70°C
–40 to +85°C
–40 to +105°C
–40 to +125°C
0 to +70°C
–40 to +85°C
–40 to +105°C
–40 to +125°C
0 to +70°C
–40 to +85°C
–40 to +105°C
–40 to +125°C
Order Number
MC68HC705P9P
MC68HC705P9CP
MC68HC705P9VP
MC68HC705P9MP
MC68HC705P9DW
MC68HC705P9CDW
MC68HC705P9VDW
MC68HC705P9MDW
MC68HC705P9S
MC68HC705P9CS
MC68HC705P9VS
MC68HC705P9MS
MC68HC705P9 — Rev. 4.0
MOTOROLA
Ordering Information
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Technical Data
151