MC68HC705P9 Datasheet, PDF (150/160 Pages) Motorola, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Mechanical Specifications
13.4 28-Pin Cerdip — Case #733
28
1
N
-T-
SEATING
PLANE
H
-A-
G
15
B
14
C
L
K
M
J
F
D 28 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONS A AND B INCLUDES MENISCUS.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
INCHES
MILLIMETERS
DIM
MIN MAX
MIN MAX
A 1.435 1.490 36.45 37.84
B 0.500 0.605 12.70 15.36
C 0.160 0.230 4.06 5.84
D 0.015 0.022 0.38 0.55
F
0.050 0.065
1.27
1.65
G
0.100 BSC
2.54 BSC
J
0.008 0.012
0.20
0.30
K 0.125 0.160 3.18 4.06
L
0.600 BSC
15.24 BSC
M
0°
15°
0°
15°
N 0.020 0.050 0.51 1.27
13.5 28-Pin SOIC — Case #751F
28
1
-T-
-A-
15
-B-
14X P
0.010 (0.25) ^M B ^M
14
28X D
0.010 (0.25) ^M T A ^S B ^S
M
R X 45°
26X G
C
-T-
SEATING
PLANE
K
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 17.80 18.05 0.701 0.711
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F
F 0.41 0.90 0.016 0.035
G
1.27 BSC
0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M
0°
8°
0°
8°
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
Technical Data
150
Mechanical Specifications
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Go to: www.freescale.com
MC68HC705P9 — Rev. 4.0
MOTOROLA