1GB-DDR3L-AS4C64M16D3L Datasheet, PDF (53/90 Pages) Alliance Semiconductor Corporation – JEDEC Standard Compliant

1Gb DDR3L – AS4C64M16D3L
Figure 22. ODT must be disabled externally during Reads by driving ODT low
(CL=6; AL=CL-1=5; RL=AL+CL=11; CWL=5; ODTLon=CWL+AL-2=8; ODTLoff=CWL+AL-2=8)
CK#
T0
T1
CK
COMMAND READ
ADDRESS
VALID
NOP
ODT
RTT
DQS, DQS#
DQ
T2
T3
T4
T5
NOP
NOP
NOP
NOP
ODTLoff = CWL + AL - 2
RTT_NOM
RL = AL + CL
T6
NOP
T7
NOP
T8
NOP
T9
T10
T11
T12
T13
T14
T15
T16
T17
NOP
NOP
NOP
NOP
NOP
NOP
NOP
NOP
NOP
ODTLon = CWL + AL - 2
tAOF(min)
tAOF(max)
tAON(max)
RTT_NOM
Din
Din
Din
Din
Din
Din
Din
Din
b
b+1
b+2
b+3
b+4
b+5
b+6
b+7
TRANSITIONING DATA
Don't Care
 Dynamic ODT
In certain application cases and to further enhance signal integrity on the data bus, it is desirable that the
termination strength of the DDR3L SDRAM can be changed without issuing an MRS command. This requirement
is supported by the “Dynamic ODT” feature as described as follows:
Functional Description
The Dynamic ODT Mode is enabled if bit (A9) or (A10) of MR2 is set to ‘1’. The function is described as follows:
Two RTT values are available: RTT_Nom and RTT_WR.
- The value for RTT_Nom is preselected via bits A[9,6,2] in MR1.
- The value for RTT_WR is preselected via bits A[10,9] in MR2.
During operation without write commands, the termination is controlled as follows:
- Nominal termination strength RTT_Nom is selected.
- Termination on/off timing is controlled via ODT pin and latencies ODTLon and ODTLoff.
When a Write command (WR, WRA, WRS4, WRS8, WRAS4, WRAS8) is registered, and if Dynamic ODT is
enabled, the termination is controlled as follows:
- A latency ODTLcnw after the write command, termination strength RTT_WR is selected.
- A latency ODTLcwn8 (for BL8, fixed by MRS or selected OTF) or ODTLcwn4 (for BC4, fixed by MRS or
selected OTF) after the write command, termination strength RTT_Nom is selected.
- Termination on/off timing is controlled via ODT pin and ODTLon, ODTLoff.
The following table shows latencies and timing parameters which are relevant for the on-die termination control in
Dynamic ODT mode.
The dynamic ODT feature is not supported at DLL-off mode. User must use MRS command to set RTT_WR,
MR2 [A10,A9 = [0,0], to disable Dynamic ODT externally.
When ODT is asserted, it must remain high until ODTH4 is satisfied. If a Write command is registered by the
SDRAM with ODT high, then ODT must remain high until ODTH4 (BL=4) or ODTH8 (BL=8) after the Write
command. ODTH4 and ODTH8 are measured from ODT registered high to ODT registered low or from the
registration of Write command until ODT is register low.
Confidential
53
Rev. 2.0
Aug. /2014