1GB-DDR3L-AS4C64M16D3L Datasheet, PDF (2/90 Pages) Alliance Semiconductor Corporation – JEDEC Standard Compliant

1Gb DDR3L – AS4C64M16D3L
Confidential
64M x 16 bit DDR3L Synchronous DRAM (SDRAM)
Advanced (Rev. 1.0, April. /2014)
Features
 ^{JEDEC Standard Compliant}
 ^{Power supplies: V}DD ^{& V}DDQ ^{= +1.35V}
 ^{Backward compatible: V}DD ^{& V}DDQ ^{= 1.5V +/- 0.075V}
 ^{Operating temperature:}
- Commercial (0 ~ 95°C)
- Industrial (-40 ~ 95°C)
 ^{Supports JEDEC clock jitter specification}
 ^{Fully synchronous operation}
 ^{Fast clock rate: 800MHz}
 ^{Differential Clock, CK & CK#}
 ^{Bidirectional differential data strobe}
-DQS & DQS#
 ^{8 internal banks for concurrent operation}
 ^{8n-bit prefetch architecture}
 ^{Internal pipeline architecture}
 ^{Precharge & active power down}
 ^{Programmable Mode & Extended Mode registers}
 ^{Additive Latency (AL): 0, CL-1, CL-2}
 ^{Programmable Burst lengths: 4, 8}
 ^{Burst type: Sequential / Interleave}
 Output Driver Impedance Control
 8192 refresh cycles / 64ms
- Average refresh period
7.8μs @ -40℃ ≦TC≦ +85℃
3.9μs @ +85℃ ＜TC≦ +95℃
 Write Leveling
 OCD Calibration
 Dynamic ODT (Rtt_Nom & Rtt_WR)
 ^{RoHS compliant}
 ^{Auto Refresh and Self Refresh}
 ^{96-ball 9 x 13 x 1.2mm FBGA package}
- Pb and Halogen Free
Overview
The 1Gb Double-Data-Rate-3 (DDR3L) DRAMs is
double data rate architecture to achieve high-speed
operation. It is internally configured as an eight bank
DRAM.
The 1Gb chip is organized as 8Mbit x 16 I/Os x 8
bank devices. These synchronous devices achieve high
speed double-data-rate transfer rates of up to 1600
Mb/sec/pin for general applications.
The chip is designed to comply with all key DDR3L
DRAM key features and all of the control and address
inputs are synchronized with a pair of externally
supplied differential clocks. Inputs are latched at the
cross point of differential clocks (CK rising and CK#
falling). All I/Os are synchronized with differential DQS
pair in a source synchronous fashion.
These devices operate with a single 1.35V -0.067V
/+0.1V power supply and are available in BGA
packages.
Table 1. Speed Grade Information
Speed Grade
Clock Frequency
DDR3L-1600
800 MHz
CAS Latency
11
t_RCD (ns)
13.75
t_RP (ns)
13.75
Table 2. Ordering Information
Product part No
Org
Temperature
Package
AS4C64M16D3L-12BCN
AS4C64M16D3L-12BIN
64M x 16
64M x 16
Commercial (Extended)
0°C to 95°C
Industrial
-40°C to 95°C (Extended)
96-ball FBGA
96-ball FBGA
Confidential
2
Rev. 2.0
Aug. /2014