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| DS90UH947-Q1 Datasheet, PDF (6/87 Pages) Texas Instruments – 1080p OpenLDI to FPD-Link III Serializer with HDCP | |||
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DS90UH947-Q1
SNLS455 â NOVEMBER 2014
7 Specifications
7.1 Absolute Maximum Ratings
MIN
Supply Voltage â VDD11
Supply Voltage â VDD18
Supply Voltage â VDDIO
OpenLDI Inputs
â0.3
-0.3
â0.3
-0.3
LVCMOS I/O Voltage
â0.3
1.8V Tolerant I/O
-0.3
3.3V Tolerant I/O
-0.3
FPD-Link III Output Voltage
â0.3
Junction Temperature
For soldering specifications:
see product folder at www.ti.com and www.ti.com/lit/an/snoa549c/snoa549c.pdf
MAX
1.7
2.5
2.5
2.75
(VDDIO + 0.3)
2.5
4.0
1.7
150
www.ti.com
UNIT
V
V
V
V
V
V
V
V
°C
7.2 Handling Ratings
Tstg
V(ESD)
Storage temperature range
Electrostatic discharge
64 Lead VQFN Package
Human body model (HBM), per AEC Q100-002(1)
Charged device model (CDM), per AEC Q100-011
ESD Rating (IEC 61000-4-2)
RD = 330Ω, CS = 150pF
ESD Rating (ISO10605)
RD = 330Ω, CS = 150pF
RD = 2KΩ, CS = 150pF or 330pF
Air Discharge (DOUT0+, DOUT0-, DOUT1+, DOUT1-)
Contact Discharge (DOUT0+, DOUT0-, DOUT1+, DOUT1-)
Air Discharge (DOUT0+, DOUT0-, DOUT1+, DOUT1-)
Contact Discharge (DOUT0+, DOUT0-, DOUT1+, DOUT1-)
MIN
-65
-2
-750
-15
-8
-15
-8
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
MAX
+150
+2
+750
+15
+8
+15
+8
7.3 Recommended Operating Conditions
Supply Voltage (VDD11)
Supply Voltage (VDD18)
LVCMOS Supply Voltage (VDDIO)
VDDI2C, 1.8V Operation
VDDI2C, 3.3V Operation
Operating Free Air Temperature (TA)
OpenLDI Clock Frequency (Single Link)
OpenLDI Clock Frequency (Dual Link)
MIN
1.045
1.71
1.71
1.71
3.135
â40
25
50
NOM
1.1
1.8
1.8
1.8
3.3
+25
MAX
1.155
1.89
1.89
1.89
3.465
+105
170
170
UNIT
°C
kV
V
kV
kV
UNIT
V
V
V
V
V
°C
MHz
MHz
7.4 Thermal Information
THERMAL METRIC(1)
VQFN
64 PINS
UNIT
RθJA
RθJC(top)
RθJB
ÏJT
ÏJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
25.8
11.4
5.1
°C/W
0.2
5.1
0.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6
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Product Folder Links: DS90UH947-Q1
Copyright © 2014, Texas Instruments Incorporated
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