C8051F850-B-GM Datasheet, PDF (19/290 Pages) Silicon Laboratories – Low-Cost 8-bit MCU Family with up to 8 kB of Flash

C8051F85x/86x
1.3. Thermal Conditions
Table 1.12. Thermal Conditions
Parameter
Symbol
Test Condition
Min
Typ
Thermal Resistance*
_JA
SOIC-16 Packages
QFN-20 Packages
—
TBD
—
TBD
QSOP-24 Packages
—
TBD
*Note: Thermal resistance assumes a multi-layer PCB with any exposed pad soldered to a PCB pad.
Max
—
—
—
Unit
°C/W
°C/W
°C/W
1.4. Absolute Maximum Ratings
Stresses above those listed under Table 1.13 may cause permanent damage to the device. This is a stress rating
only and functional operation of the devices at those or any other conditions above those indicated in the operation
listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect
device reliability.
Table 1.13. Absolute Maximum Ratings
Parameter
Symbol
Test Condition
Min
Typ
Max
Ambient Temperature Under Bias
Storage Temperature
T_BIAS
T_STG
–55
125
°C
–65
150
°C
Voltage on VDD
V_DD
Voltage on I/O pins or RST
V_IN
Total Current Sunk into Supply Pin
Total Current Sourced out of Ground
Pin
Current Sourced or Sunk by Any I/O Pin
or RST
Power Dissipation at T_A = 125 °C
I_VDD
I_GND
I_PIO
P_D
V_DD > 3.3 V
V_DD < 3.3 V
SOIC-16 Packages
QFN-20 Packages
QSOP-24 Packages
GND–0.3
GND–0.3
GND–0.3
—
400
-100
—
—
—
4.2
V
5.8
V
V_DD+2.5
V
400
mA
—
mA
100
mA
TBD
mW
TBD
mW
TBD
mW
Preliminary Rev 0.6
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