AR0330 Datasheet, PDF (8/77 Pages) ON Semiconductor – CMOS Digital Image Sensor

AR0330: 1/3-Inch CMOS Digital Image Sensor
Working Modes
Figure 2: Typical Configuration: Serial Four-Lane HiSPi Interface
Digital Digital
I/O Core
power¹ power¹
HiSPi PLL
power¹ power¹
Analog Analog
power¹ power¹
Master clock
(6–27
MHz)
From
controller
VDD_IO VDD
EXTCLK
OE_BAR
TRIGGER
SADDR
SCLK
SDATA
RESET_BAR
TEST
VAA VAA_PIX
SLVS0_P
SLVS0_N
SLVS1_P
SLVS1_N
SLVS2_P
SLVS2_N
SLVS3_P
SLVS3_N
SLVSC_P
SLVSC_N
FLASH
SHUTTER
DGND GND_SLVS
AGND
To
controller
(HiSPi-serial interface)
VDD_HiSPi_TX
VDD_IO
Digital
ground
Analog
ground
VDD
VDD_HiSPi VDD_PLL
VAA
VAA_PIX
1.oμF 0.1μF 1.oμF 0.1μF 1.oμF 0.1μF 1.oμF 0.1μF 1.oμF 0.1μF 1.oμF 0.1μF 1.oμF _0.1μF
Notes: 1. All power supplies must be adequately decoupled. ON Semiconductor recommends having 1.0F
and 0.1F decoupling capacitors for every power supply. If space is a concern, then priority must be
given in the following order: VAA, VAA_PIX, VDD_PLL, VDD_IO, and VDD. Actual values and results may
vary depending on layout and design considerations.
2. To allow for space constraints, ON Semiconductor recommends having 0.1F decoupling capacitor
inside the module as close to the pads as possible. In addition, place a 10F capacitor for each sup-
ply off-module but close to each supply.
3. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
4. The pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that cou-
pling with the digital power planes is minimized.
6. TEST pin should be tied to DGND.
7. Set High_VCM (R0x306E[9]) to 0 (default) to use the VDD_HiSPi_TX in the range of 0.4 – 0.8V. Set
High_VCM to 1 to use a range of 1.7 – 1.9V.
8. The package pins or die pads used for the MIPI data and clock as well as the parallel interface must
be left floating.
9. The VDD_MIPI package pin and sensor die pad should be connected to a 2.8V supply as VDD_MIPI is
tied to the VDD_PLL supply both in the package routing and also within the sensor die itself.
10. If the SHUTTER or FLASH pins or pads are not used, then they must be left floating.
11. If the TRIGGER or OE_BAR pins or pads are not used, then they should be tied to DGND.
12. The GND_SLVS pad must be tied to DGND. It is connected this way in the CLCC and CSP packages.
AR0330_DS Rev. U Pub. 4/15 EN
8
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