AR0330 Datasheet, PDF (71/77 Pages) ON Semiconductor – CMOS Digital Image Sensor

AR0330: 1/3-Inch CMOS Digital Image Sensor
Packages
Table 46: CSP (MIPI/HiSPi) Package Dimensions
Parameter
Package Body Dimension X
Package Body Dimension Y
Package Height
Cavity height (glass to pixel distance)
Glass Thickness
Package Body Thickness
Ball Height
Ball Diameter
Total Ball Count
Ball Count X axis
Ball Count Y axis
UBM
Pins Pitch X axis
Pins Pitch Y axis
BGA ball center to package center offset in
X-direction
BGA ball center to package center offset in
Y-direction
BGA ball center to chip center offset in X-
direction
BGA ball center to chip center offset in Y-
direction
Edge to Ball Center Distance along X
Edge to Ball Center Distance along Y
Symbol
A
B
C
C4
C3
C2
C1
D
N
N1
N2
U
J1
J2
X
Y
X1
Y1
S1
S2
Nominal
Min
Millimeters
6.278
6.648
0.700
0.041
0.400
0.570
0.130
0.250
64
8
8
0.280
0.650
0.650
0.000
6.253
6.623
0.645
0.037
0.390
0.535
0.100
0.220
0.270
-0.025
0.000
-0.025
0.000
-0.014
0.000
-0.014
0.864
1.049
0.834
1.019
Max
6.303
6.673
0.745
0.045
0.410
0.605
0.160
0.280
Nominal
0.247
0.262
0.028
0.002
0.016
0.022
0.005
0.010
Min
Inches
0.246
0.261
0.025
0.001
0.015
0.021
0.004
0.009
0.290
0.025
0.025
0.014
0.014
0.894
1.079
0.011
0.026
0.026
0.000
0.000
0.000
0.000
0.034
0.041
0.011
-0.001
-0.001
-0.001
-0.001
0.033
0.040
Max
0.248
0.263
0.029
0.002
0.016
0.024
0.006
0.011
0.011
0.001
0.001
0.001
0.001
0.035
0.042
AR0330_DS Rev. U Pub. 4/15 EN
71
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