AR0330 Datasheet, PDF (76/77 Pages) ON Semiconductor – CMOS Digital Image Sensor

AR0330: 1/3-Inch CMOS Digital Image Sensor
Revision History
• Updated “Features” on page 1
• Updated Table 1, “Available Part Numbers,” on page 1
• Updated Table 1, “Key Parameters,” on page 1
• Removed Figure 2: Gain Stages
• Updated first paragraph of “General Description” on page 6
• Moved Working Modes section to follow Functional Overview
• Updated Figure 2: “Typical Configuration: Serial Four-Lane HiSPi Interface,” on
page 8
• Updated Figure 3: “Typical Configuration: Serial MIPI,” on page 9
• Updated Figure 4: “Typical Configuration: Parallel Pixel Data Interface,” on page 10
• Updated Table 5, Pin Descriptions; moved it under new section “Pin Descriptions” on
page 12
• Added Table 6, “CSP (HiSPi/MIPI) Package Pinout,” on page 13
• Added Figure 5: “CLCC Package Pin Descriptions,” on page 14
• Added “Electrical Characteristics” on page 18
• Added “Sensor Initialization” on page 15
• Added “Sequencer” on page 32
• Added “Sensor PLL” on page 32
• Added “Pixel Output Interfaces” on page 36
• Added “Sensor Readout” on page 46
• Updated “Subsampling” on page 49
• Added “Sensor Frame Rate” on page 51
• Added “Sensor Frame Rate” on page 51
• Updated “Slave Mode” on page 53
• Added “Frame Readout” on page 56
• Added “Two-Wire Serial Register Interface” on page 60
• Added “Packages” on page 69
Rev. C, Advance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/3/10
• Updated Table 5, “Pin Descriptions,” on page 12.
• Added Figure 2: “Typical Configuration: Serial Four-Lane HiSPi Interface,” on page 8.
• Updated Figure 1: “Block Diagram,” on page 6.
• Updated pins and notes for Figure 2: “Typical Configuration: Serial Four-Lane HiSPi
Interface,” on page 8, Figure 3: “Typical Configuration: Serial MIPI,” on page 9 and
Figure 4: “Typical Configuration: Parallel Pixel Data Interface,” on page 10.
• Changed input clock range to 6-64 MHz
• Removed high dynamic range from general description
• Removed STANDBY pad from Figure 2: “Typical Configuration: Serial Four-Lane
HiSPi Interface,” on page 8 and Figure 4: “Typical Configuration: Parallel Pixel Data
Interface,” on page 10
• Changed HiSPi to SLVS in Table 5, “Pin Descriptions,” on page 12
• Updated slave mode section
• Updated Figure 36: “Slave Mode Active State and Vertical Blanking,” on page 53
• Updated Table 1, “Available Part Numbers,” on page 1
Rev. B, Advance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4/08/10
• Updated key parameters and general description
• Updated Table 3
• Removed two-wire serial interface
AR0330_DS Rev. U Pub. 4/15 EN
76
©Semiconductor Components Industries, LLC,2015.