AR0330 Datasheet, PDF (10/77 Pages) ON Semiconductor – CMOS Digital Image Sensor

Figure 4:
AR0330: 1/3-Inch CMOS Digital Image Sensor
Working Modes
Typical Configuration: Parallel Pixel Data Interface
Digital Digital
I/O core
power1 power1
PLL
power1
Analog Analog
power1 power1
VDD_IO VDD
VAA VAA_PIX
Master clock
(6–27 MHz)
From
Controller
EXTCLK
OE_BAR
TRIGGER
SADDR
SCLK
SDATA
RESET_BAR
TEST
DGND
DOUT [11:0]
PIXCLK
LINE_VALID
FRAME_VALID
FLASH
SHUTTER
To
controller
AGND
VDD_IO
Digital
ground
Analog
ground
VDD
VDD_PLL
VAA
VAA_PIX
1.0μF 0.1μF 1.0μF 0.1μF 1.0μF 0.1μF 1.0μF 0.1μF 1.0μF 0.1μF
Notes: 1. All power supplies must be adequately decoupled. ON Semiconductor recommends having 1.0F
and 0.1F decoupling capacitors for every power supply. If space is a concern, then priority must be
given in the following order: VAA, VAA_PIX, VDD_PLL, VDD_IO, and VDD. Actual values and results may
vary depending on layout and design considerations.
2. To allow for space constraints, ON Semiconductor recommends having 0.1F decoupling capacitor
inside the module as close to the pads as possible. In addition, place a 10F capacitor for each sup-
ply off-module but close to each supply.
3. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
4. The pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that cou-
pling with the digital power planes is minimized.
6. TEST pin should be tied to the ground.
7. The data and clock package pins or die pads used for the HiSPi and MIPI interface must be left float-
ing.
8. The VDD_MIPI package pin and sensor die pad should be connected to a 2.8V supply as it is tied to
the VDD_PLL supply both in the package routing and also within the sensor die itself. HiSPi Power
Supplies (VDD_HiSPi and VDD_HiSPi_TX) can be tied to ground.
9. If the SHUTTER or FLASH pins or pads are not used, then they must be left floating.
10. If the TRIGGER or OE_BAR pins or pads are not used, then they should be tied to DGND.
AR0330_DS Rev. U Pub. 4/15 EN
10
©Semiconductor Components Industries, LLC,2015.