AR0330 Datasheet, PDF (74/77 Pages) ON Semiconductor – CMOS Digital Image Sensor

AR0330: 1/3-Inch CMOS Digital Image Sensor
Revision History
Rev. P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/17/12
• Updated “Features” on page 1
• Table 1, “Available Part Numbers,” on page 1
• Updated Figure 1: “Block Diagram,” on page 6
• Updated Figure 51: “Image Orientation With Relation To Camera Lens,” on page 72
Rev. N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/29/12
• Removed Parallel/MIPI information:
– deleted Table 7, “CSP (Parallel/MIPI) Package Pinout,” on page 14
– deleted
Rev. M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/17/12
• Updated Table 6, “CSP (HiSPi/MIPI) Package Pinout,” on page 13
• Updated Table 7, “CSP (Parallel/MIPI) Package Pinout,” on page 14
• Updated Table 9, “DC Electrical Definitions and Characteristics (MIPI Mode),” on
page 18
• Updated trademarks
Rev. L . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12/22/11
• Updated title of Figure 3: “Typical Configuration: Serial MIPI,” on page 9
• Changed title of Table 5, “Pin Descriptions” to “CLCC Package Pinout”
• Replaced Table 6, “CSP Package Pin Descriptions” with Table 6, CSP (HiSPi/MIPI)
Package Pinout and Table 7, “CSP (Parallel/MIPI) Package Pinout,” on page 14
• Updated “Packages” on page 69
• Replaced Figure 52, CSP Package with Figure 50: “CSP HiSPi Package,” on page 70 and
Figure 53: “CSP Parallel/MIPI Package Outline Drawing,” on page 74
• Replaced Table 44, “CSP Package Dimensions” with Table 46, CSP (MIPI/HiSPi)
Package Dimensions and Table 46, “CSP (MIPI/HiSPi) Package Dimensions,” on
page 71
Rev. K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/26/11
• Updated to Production
• Updated Table 1, “Available Part Numbers,” on page 1
• Updated Table 1, “Key Parameters,” on page 1
• Updated Figure 1: “Block Diagram,” on page 6
• Updated Table 4, “Available Working Modes in the AR0330 Sensor,” on page 7
• Updated notes for Figure 2: “Typical Configuration: Serial Four-Lane HiSPi Interface,”
on page 8
• Updated notes for Figure 3: “Typical Configuration: Serial MIPI,” on page 9
• Updated notes for Figure 4: “Typical Configuration: Parallel Pixel Data Interface,” on
page 10
• Updated Table 5, “Pin Descriptions,” on page 12
• Updated “Power-Up Sequence” on page 15
• Updated Figure 6: “Power Up,” on page 15
• Updated Table 7, “Power-Up Sequence,” on page 16
• Updated “Power-Down Sequence” on page 17
• Updated Table 8, “Power-Down Sequence,” on page 17
• Updated Figure 7: “Power Down,” on page 17
• Added Table 9, “DC Electrical Definitions and Characteristics (MIPI Mode),” on
page 18
AR0330_DS Rev. U Pub. 4/15 EN
74
©Semiconductor Components Industries, LLC,2015.