AR0330 Datasheet, PDF (49/77 Pages) ON Semiconductor – CMOS Digital Image Sensor

AR0330: 1/3-Inch CMOS Digital Image Sensor
Subsampling
Subsampling
The AR0330 supports subsampling. Subsampling allows the sensor to read out a smaller
set of active pixels by either skipping or binning pixels within the readout window. The
working modes described in the data sheet that use subsampling are configured to use
either 2x2 or 3x3 subsampling.
Figure 33: Horizontal Binning in the AR0330 Sensor
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lsb
lsb
lsb
-
lsb ^lsb
Figure 34:
Horizontal binning is achieved either in the pixel readout or the digital readout. The
sensor will sample the combined 2x or 3x adjacent pixels within the same color plane.
Vertical Row Binning in the AR0330 Sensor
e^-
e^-
e^-
e^-
AR0330_DS Rev. U Pub. 4/15 EN
Vertical row binning is applied in the pixel readout. Row binning can be configured of 2x
or 3x rows within the same color plane. ON Semiconductor recommends not to use 3x
binning in AR0330 as it may introduce some image artifacts.
Pixel skipping can be configured up to 2x and 3x in both the x-direction and y-direction.
Skipping pixels in the x-direction will not reduce the row time. Skipping pixels in the y-
direction will reduce the number of rows from the sensor effectively reducing the frame
time. Skipping will introduce image artifacts from aliasing.
The sensor increments its x and y address based on the x_odd_inc and y_odd_inc value.
The value indicates the addresses that are skipped after each pair of pixels or rows has
been read.
The sensor will increment x and y addresses in multiples of 2. This indicates that a
GreenR and Red pixel pair will be read together. As well, that the sensor will read a Gr-R
row first followed by a B-Gb row.
x subsampling factor
=
1-----+-----x---_---o---d---d---_---i--n---c-
2
(EQ 16)
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